In a move that significantly broadens its portfolio, Xilinx has unveiled the UltraScale+ family of FPGAs, 3D ICs and MPSoCs. The UltraScale portfolio now spans 20nm and 16nm FPGA, SoC and 3D ICs, with TSMC's 16FF+ 3D transistors said to bring a 'significant' boost in performance/Watt.
Giles Peckham, EMEA marketing director, said: "The UltraScale+ portfolio offers a range of new capabilities that look to address the challenges customers tell us they face, such as performance and power scalability, systems integration and greater intelligence, as well as security, safety and reliability. As a result, we expect these additions will significantly expand the markets we are able to address."
Those markets are expected to include next generation applications such as LTE Advanced and early 5G, terabit wireless communications, automotive and industrial IoT.
Amongst the improvements to the family are: UltraRAM, which can replace the need for external memory; and SmartConnect, an intelligent optimisation technology.
Meanwhile, Zynq UltraScale+ MPSoCs offer heterogeneous multiprocessing, based on a quad core Cortex-A53 and a dual core Cortex-R5 for real time applications.
Author
Graham Pitcher
Source: www.newelectronics.co.uk