In order to operate reliably at these extended temperatures, the devices feature a copper lead frame. This provides a stronger solder joint that closely matches the temperature coefficient of a printed circuit board (PCB) compared to traditional alloy methods. In addition, the devices will shortly meet the automotive specific production part approval process (PPAP). This accreditation is used in the automotive supply chain to establish confidence in component suppliers and their production processes. The ICs are also undergoing certification against the Automotive Electronic Council Q100 (AEC-Q100) standard that establishes the stress qualification for integrated circuits.
Source: www.channel-e.biz