Archive : 5 November 2008 год

Renesas Technology Europe has commenced development of low power and fast SRAM products that are specifically suited to automotive applications. They are available as 4, 16, or 32Mbit low power SRAM and 4Mbit fast SRAM devices. Sample shipments will commence during June 2009 followed by mass production during July 2009. The new product line-up has been designed to meet the wide range of operating temperatures specified by automotive manufacturers, typically ranging from -40 degrees C to + 105 degrees C.

In order to operate reliably at these extended temperatures, the devices feature a copper lead frame. This provides a stronger solder joint that closely matches the temperature coefficient of a printed circuit board (PCB) compared to traditional alloy methods. In addition, the devices will shortly meet the automotive specific production part approval process (PPAP). This accreditation is used in the automotive supply chain to establish confidence in component suppliers and their production processes. The ICs are also undergoing certification against the Automotive Electronic Council Q100 (AEC-Q100) standard that establishes the stress qualification for integrated circuits.