Archive : 2016 год

Power Integrations and Cypress Semiconductor have announced a joint reference design describing a 20W, USB-PD compliant AC/DC power converter targeted at chargers for smart mobile devices. The design, titled DER-533, pairs the EZ-PD CCG2 USB Type-C port controller from Cypress with Power Integrations’ InnoSwitch-CP off-line CV/CC flyback swit...

A business built on the premise of licensing IP can prove lucrative, as evidenced by ARM’s latest financial report. But when the number of deals signed declines, times can be tough, as Imagination Technologies has found out.ARM says its Q4 2015 revenues grew by 19% to £269.1million. In dollar terms, revenues rose by 14% to $407.9m....

Looking to drive what it says is the ‘next wave of innovation in the embedded, wearables and IoT sectors, ARM has announced the Cortex-A32, the smallest device yet based on its v8 architecture. However, the part has been optimised for 32bit processing.Intended to provide an upgrade path for those using Cortex-A5 and A7 cores, the A32 is s...

Researchers at Aalto University have fabricated an electricity conducting material combination with what they call ‘especially promising properties’ by merging graphene and gallium selenide to create a heterojunction.While many 2D structures that combine with graphene have been fabricated manually, the structure developed by Riikone...

NXP is using Embedded World as a platform to boost the prospects of near field communications (NFC) technology in a range of applications.According to Rafael Sotomajor, SVP of NXP’s secure mobile transactions business, ‘the time is now’ for NFC, but he concedes that further work needs to be done to increase its acceptance. &ld...

While analogue transmitters are less suitable for integration in advanced CMOS nodes, digital transmitters typically fall short when it comes to high-end performance parameters such as out-of-band noise and spurious emission.Belgian nanoelectronics research center imec and Vrije Universiteit Brussel claim to have overcome this with a transmitte...

The first family in a range of SoCs intended to support 3D instrument clusters has been launched by Renesas. The R-Car D1 Series is intended to provide a smooth migration path for automotive system manufacturers as the use of colour LCD panels in instrument cluster systems becomes more widespread.In the future, the company believes, display siz...

University of Utah engineers have discovered a 2D semiconducting material that could enable faster devices which consume less power.While researchers in this field have recently discovered 2D materials such as graphene, molybdenum disulphide and borophene, these only allow the movement of electrons. According to associate professor Ashutosh Tiw...

The Centre for Process Innovation (CPI) and Heidelberg Instruments have developed a high resolution, high speed roll to roll digital lithography tool for the manufacture of flexible organic thin film transistors (OTFT) used in next generation applications such as foldable display screens, sensors, integrated circuits and photo-detectors.The mac...

In a move targeted at developers not familiar with the PIC microcontroller, Microchip has launched MPLAB Xpress, a Cloud based integrated development environment (IDE) which it claims is the easiest way to get started with PIC MCUs.The free IDE is said to provide access to popular features from the company’s MPLAB X IDE, including a libra...