In a move which broadens its support for processor core debug, UltraSoC has added Cadence's Tensilica Xtensa family to its UltraDebug package."UltraSoC has innovative technology when it comes to SoC debug," said Chris Jones, product marketing group director of the Tensilica division of the IP Group at Cadence. "Its technology...

As part of the £100million for research into intelligent mobility announced by the Chancellor in the Spring 2015 Budget, the government has launched a £20m competitive fund for collaborative research and development into driverless vehicles, along with a code of practice for testing.The measures announced by Business Secretary Sajid...

Researchers from North Carolina State University and Brown University have found that zinc oxide and silicon nanowires have a pronounced anelasticity. This could enable the development of stretchable, flexible wearable devices.It was found that – when bent – the nanowires would return more than 80% of the way to their original shape...

RS Components (RS) claims it is making energy-harvesting applications easier and faster to develop with the Wireless Switch Evaluation Kit and modular snap and rocker switches by Cherry.The AFIK-1002 evaluation kit is said to contain everything needed to setup wireless links using self-powered switches, and to test key parameters such as signal...

TSMC hasn't given up hope on using EUV lithography at the 10nm node, but it appears to be more likely to be introduced at the 5nm node. Speaking on a conference call, Mark Liu, TSMC's president and co-CEO, pictured, said: "We are planning to exercise EUV at 7nm and are currently planning to use EUV at 5nm. But it depends on certain dev...

Renesas Electronics has developed the RL78/G1D Group of MCUs that combines Bluetooth Low Energy technology with the RL78 MCU. The MCUs are claimed to Extend Battery Life and simplify circuit design.The current consumption of the RL78/G1D is claimed to be the lowest in the industry at 3.5mA during reception and 4.3mA during transmission. Adaptab...

Digi-Key has announced their partnership with the ARM University Programme to distribute 'Lab-in-a-Box' (LiB) to higher educational institutions around the globe.The LiB contains ARM-based technology and high quality, rigorous training materials that support electronics and computer engineering courses. Since its launch in February 2014...

IDT has launched an Open High-Performance Analytics and Computing (HPAC) Lab to address the needs of enterprise and cloud computing end users. The lab supports heterogeneous processing technologies from CPU and accelerator vendors who are connecting their hardware with IDT's portfolio of RapidIO and PCIe interconnect semiconductors, advanced ti...

An international collaboration led by the University of Cambridge and IBM has developed a method that allows combinations of different materials to be grown in a nanowire, providing what the team calls 'a useful building block' for electrical, optical and energy harvesting devices."The key to building functional nanoscale devices i...

Looking to demonstrate the benefits of nano-patterning technology and spread its use beyond semiconductors, CEA-Leti and EV Group have launched the INSPIRE programme."Leti and EVG have a long history of collaborating on ways to bring new technologies to market at reasonable costs for the benefits of our customers," said Laurent Pain,...