Longsys Technology has used CES in Las Vegas to announce what it says is the smallest IoT WiFi silicon in package (SiP) module. The LTP0201 is designed for use in IoT and wearable devices that can connect to other smart devices or connect directly to the Internet.
Measuring 6 x 6mm, the module integrates a 32bit RISC MCU, SRAM, SPI NOR flash, power management and RF parts, to provide a high performance, low cost, and low power consumption solution for connected products.
The part, which enables IEEE802.11b/g/n communications, has an integrated TCP/IP protocol stack and supports 1x1 MIMO. It takes just 2ms to wake up and transmit packets, whilst standby power consumption is said to be less than 1mW in DTIM3 mode. For security, it integrates WEP, TKIP, AES, and WAPI HW secure engines.
Longsys has also announced the LTP3226, a WiFi and Bluetooth combination SiP. Along with the features available in the LTP0201, this device integrates Bluetooth 4.1/BLE functionality.
Longsys’ general manager Dave Pang said: “In five years, more than 60% of IoT and wearable products will incorporate SiP modules because of their size and more consistent RF performance.”
Author
Graham Pitcher
Source: www.newelectronics.co.uk