Archive : 3 July 2021 год

Marvell has introduced the OCTEON 10 DPU that's been designed to accelerate and process a broad spectrum of security, networking, and storage workloads required by 5G, cloud, carrier and enterprise datacentre applications.

OCTEON is Marvell's response to the increased demand for data centric compute and by combining compute with hardware accelerators, this DPU offers a significant TCO advantage and a number of new features.

According to Marvell it delivers three times the performance and 50 percent lower power compared to previous generations of OCTEON, an it is the first solution to be designed on a 5nm process to incorporate Arm Neoverse N2 cores. Among a number of other firsts claimed by Marvell are the first inline artificial intelligence/machine learning (AI/ML) hardware acceleration, the first integrated 1 terabit switch and the first solution to incorporate vector packet processing (VPP) hardware accelerators.

"To meet and exceed the growing data processing requirements for network, storage, and security workloads, Marvell focused on significant DPU innovations across compute, hardware accelerators, and high speed I/O," said John Sakamoto, vice president of Marvell's Infrastructure Processors Business Unit. "The OCTEON 10 brings compute leadership, supports networking and security workloads exceeding 400G, and incorporates leading edge I/O including DDR5 and PCIe 5.0."

Unlike other DPU solutions, which are limited to data centre use cases, the OCTEON 10 is scalable to service hyperscale cloud workloads, carrier and enterprise datacentres, 5G wireless transport, SD-WAN, and even fan-less networking edge boxes.

In order to deliver best-in-class power and performance across these applications, each OCTEON 10 device combines the optimal mix of compute, hardware acceleration, data path bandwidth, and industry-leading I/O including PCIe 5.0 and DDR5.

The OCTEON 10 family SDK is an open platform which leverages the Arm ecosystem. The SDK support includes networking, security, and storage stacks, comprehensive DPDK and VPP extensions, and support for virtualization and containers.

Author
Neil Tyler

Source: www.elevatesemi.com

Atmosic Technologies and Globalscale Technologies are making available what is being claimed is the lowest power Bluetooth Low Energy module currently available on the market.

Atmosic, a specialist in ultra-low-power wireless platforms for the Internet of Things (IoT), and Globalscale, a supplier of IoT solutions, said that with a transmit power of only 2.4mA at 0dBm and receiver power under 1mA, the Atmosic Bluetooth LE 5.0 radio consumes 3X to 5X less power than other low power Bluetooth LE products for battery-based product designs.

Globalscale is using the Atmosic M2 Series ATM2202 chip as a low-power wireless processor for its RistrettoBin module. Measuring only 14mm by 8mm, the module is intended for energy-critical consumer, industrial, medical and commercial applications. With an on-chip Arm Cortex-M0 processor and a wide range of I/O interfaces the module has been designed to run energy-critical, edge-of-network applications.

“This module provides ultra-low power wireless connectivity to the growing range of energy-critical applications,” said Srinivas Pattamatta, VP of Marketing and Business Development at Atmosic Technologies. “With Atmosic’s power efficiency, the RistrettoBin module will significantly extend the battery life of IoT devices, reducing maintenance costs and time.”

In addition to the low power Bluetooth LE radio, the chip contains a specially designed, ultra-low power (150nA) wake-up receiver that can operate even when the remainder of the chip is in low-power hibernate mode. Unlike a typical Bluetooth LE radio that continuously uses energy transmitting beacons, the ATM2202 can remain in low-power hibernate mode until it receives a chip-specific coded message from another Bluetooth radio.

“The RistrettoBin module represents an exciting milestone for the IoT industry, offering ultra-low power consumption in an super compact design,” explained Bryan Cheng, VP of Sales & Marketing at GlobalScale Technologies. “Furthermore, the module’s wide range of I/O interfaces and tools – including an AT command software package and SDK – gives manufacturers more design flexibility to customise the module for different types of applications and use cases.”

The module comes with an easy-to-use AT command software package, plus a comprehensive SDK for wireless application development. A library of software reference designs from Atmosic is also available for many battery-based IoT applications, including contact tracing, wireless keyboards, cold chain tracking and electronic shelf labels.

Author
Neil Tyler

Source: www.elevatesemi.com