Archive : 16 September 2016 год

Globalfoundries plans to deliver a 7nm FinFET semiconductor process that it says will offer the ultimate in performance for the next era of computing applications. The move will require an ‘multi-billion dollar investment’ in Fab 8 in Malta, New York, to enable 7nm FinFET development and production.

According to the company, the process is expected to deliver more than twice the logic density and a 30% performance boost, compared to current 16/14nm foundry FinFET offerings. Because the process will be based on an industry standard FinFET transistor architecture and will use optical lithography – with EUV compatibility at key levels – the approach is likely to accelerate move from the company’s 14nm FinFET technology.

“The industry is converging on 7nm FinFET as the next long lived node, which represents a unique opportunity for Globalfoundries to compete at the leading edge,” said CEO Sanjay Jha. “We are well positioned to deliver a differentiated 7nm FinFET technology by tapping our years of experience manufacturing high-performance chips, the talent and know-how of our former IBM Microelectronics colleagues and the world-class R&D pipeline from our research alliance. No other foundry can match this legacy of manufacturing high-performance chips.”

The 7nm FinFET technology will be supported by a full platform of foundation and complex IP, including an ASIC offering. Test chips with IP from lead customers have already started running in Fab 8 and the technology is expected to be ready for customer product design starts in the second half of 2017, with ramp to risk production in early 2018.

Author
Graham Pitcher

Source:  www.newelectronics.co.uk

Embedded and mobile software development specialist Adeneo has renamed itself Witekio to highlight that it has changed its focus to system software integration.

CEO Yannick Chammings, pictured, said: “Development of embedded devices requires more skills, but it’s not just a question of technical expertise; there is also the need for integration ability and this requires a different type of company.”

According to Witekio, it has been preparing for the move over several years by deepening skillsets so that it can engineer and integrate intelligent systems software for any device from the hardware to the cloud.

Chammings said Witekio doesn’t want to cover the entire market. “We’re looking to work with smaller companies to help them manage their integration challenges – their biggest challenge is to keep their design teams up to speed with technology. But there are also new players who see opportunities in the IoT, but who lack the required skills.

“Our new positioning as system software integrator, supported by our new identity, will allow us to be ahead of the curve,” he concluded.

Author
Graham Pitcher

Source:  www.newelectronics.co.uk

Described as dual-band wireless MCU with the lowest power consumption, the SimpleLink CC1350 from Texas Instruments supports sub GHz and Bluetooth Low Energy connectivity.

Part of TI’s SimpleLink platform, the CC1350 wireless MCU is said to allow developers to move from a three chip solution to a single chip, while reducing design complexity, saving power, cost and board space.

With a range of up to 20km and operating from a coin cell battery, the Cortex-M3 based MCU is targeted at applications in the building and factory automation, alarm and security, smart grid, asset tracking and wireless sensor network sectors.

The CC1350 portfolio will support operation in the 315, 433, 470, 500, 779, 868, 915 and 920MHz bands, as well as 2.4GHz ISM. However, the initial devices will work at 868, 915 and 920MHz. According to the supplier, the device will be available in 4 x 4, 5 x 5 and 7 x 7mm QFN packages, with the 7 x 7mm package available now.

Author
Graham Pitcher

Source:  www.newelectronics.co.uk