Archive : 17 September 2008 год

Chomerics Europe has introduced a thermal grease designed to conduct heat between hot components and heatsinks or equipment enclosures. T670 is a silicone based material with a high bulk thermal conductivity of 3W/m-k. T670 can be screen printed, stencilled or dispensed and requires virtually no compressive force to achieve excellent surface wetting results and very low interfacial resistance.

Typical bond line thickness is approximately 0.001in. T670 thermal grease is ideal for filling variable tolerances in electronics assemblies and heatsink applications. It is also well suited to rework and field repair situations. The material requires no cure cycle, mixing or refrigeration. Operating temperature range is -50ºC to +200ºC.