Archive : 26 October 2007 год

Vishay announced a series of self-regulating PTC (positive temperature coefficient) thermistors for heating applications. The directly heated PTCHP series devices are optimized for use as heating elements in home appliances such as thermal actuators, insecticide and perfume vaporizers, and small warming plates. Minimizing the parts count and overall cost in designs where a controlled amount of heat is needed, the self-regulating thermistors eliminate the need for a thermostat or other control circuitry. The PTCHP devices offer a 1200-Ω resistance value at +25°C with a ±35% tolerance, and are specified for a 230-VAC rated voltage and 265-VAC maximum voltage. The thermistors are designed to operate over a -40°C to +85°C temperature range and are rated for surface temperatures from 100°C to 200°C. Featuring Ag-metallization suitable for clamping, the devices are RoHS 2002/95/EC and WEEE 2002/96/EC compliant.

International Rectifier has introduced a set of 600V high-voltage integrated circuits (HVIC). This IRS212x family of 600V single-channel gate drivers is suitable for motor control applications at low-, mid- and high-voltage levels and in a variety of circuit topologies including three-phase inverter, H-bridge, and other topologies utilizing MOS-gated power devices. The family provides a gate voltage up to 20V, a typical turn-on current of 290mA, a typical turn-off current of 600mA, and accept input logic levels of 3.3V, 5V, and 15V. Integrated protection features include under-voltage lockout protection, over-current detection and protection, and fault reporting.

 The ICs utilize an advanced high-voltage IC process platform, known as G5 HVIC, which enables a host of new features and enhancements. A next-generation high-voltage level-shifting and termination technology delivers superior electrical over-stress protection and higher field reliability. All G5 HVICs have passed extensive quality and reliability testing. Long-term reliability testing was performed to validate robustness beyond the expected useful lifetime of products in certain application environments. This qualification required the devices pass several stress conditions including a 2000 hour, high-temperature biased test. Additionally, the devices benefit from improvements in reliability due to silicon technology and packaging enhancements.

The advanced packaging equipment and materials, for example, combined with recent advancements in mold-compound injection techniques, allow these devices to be less sensitive to moisture and provide improvements in the plastic-to-die interface, an important consideration as peak soldering temperatures have increased with the adoption of lead-free soldering materials. The surface mount SO-8 packages are qualified to MSL2 (moisture sensitivity level 2) while all other surface mount packages are MSL3 qualified.