A packaging technology for IGBTs developed by Infineon Technologies is said to support better thermal performance and simpler manufacturing.A packaging technology for IGBTs developed by Infineon Technologies is said to support better thermal performance and simpler manufacturing.
Trenchstop Advanced Insulation has the same footprint as a standard TO-247, but provides 100% insulation, according to Infineon, while eliminating the need for thermal insulation films or thermal grease. Better heat transfer from the IGBT chip to the heat sink increases power density, reliability and reduces system and manufacturing costs.
The thermal resistance of the new housing is said to be 50% less than in a TO-247 FullPak and 35% lower than in a standard TO-247 with insulation film. This is said to result in a 10°C lower operating temperature. In addition, a coupling capacity of 38pF improves EMI behaviour and enables smaller filters to be used.
The Trenchstop Advanced Isolation package will be available in Q3 2017. The portfolio will initially feature IGBTs with power ratings ranging from 40A to 90A operating at 600V.
Author
Graham Pitcher
Source: www.newelectronics.co.uk