CEVA has introduced a silicon-based DSP development platform to accelerate the deployment of ‘smart and connected’ devices. The platform incorporates a wealth of processing, connectivity, sensing and application software which are the building blocks for prototyping IoT devices.
The platform is built around a power-optimised CEVA-TeakLite-4 DSP and subsystem implemented in silicon through collaboration with SMIC who fabricated it at their IoT-centric 55nmLP process. Running at 500MHz, the DSP provides designers with a means to add ‘smart and connected’ capabilities to these devices, including always-on sensing, local processing and intelligence and connectivity. The platform also provides real-time power measurement that allows developers to optimise and power-tune their DSP software.
“Developing diverse IoT applications for the mobile, wearable, and smarthome markets require highly integrated development platforms that combine sensing, processing, and connectivity capabilities,” said Moshe Sheier, director of strategic marketing at CEVA.
CEVA and its partners also offer audio, voice and sensing software and applications for the CEVA-TeakLite-4 DSP, including Sensory’s always-on voice activation and speech recognition, NXP Software’s multi-microphone noise reduction, Cypher’s neural-network based voice isolation technology, Cywee Motion sensor-fusion algorithms and more than 100 other software functions.
Author
Tom Austin-Morgan
Source: www.newelectronics.co.uk